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Widely used by the electronic industry for packaging applications, lead-tin eutectic solder has been used for decades and meets performance requirements well, but its lead content makes it an environmental hazard.
To comply with the 2006 EU's Restriction of Hazardous Substances (RoHS) Directive, equipment manufacturers must use lead-free solders to produce electrical equipment.
The main difference between lead-tin eutectic and the most commonly used lead-free solders is its melting point. The melting point of SnAgCu is 34°C higher than that of eutectic SnPb. High temperatures can damage components and laminate and so it is important to:
- use as low a temperature as possible
- avoid heat-sensitive components - damage includes plastics melting, delamination of ICs, cracking of brittle ceramic devices, loss of fluid from electrolytic capacitors, and
- consider using high temperature g laminate for thicker PCBs with many layers and large high thermal mass components - laminate damage can include warping, delamination, and cracks in plated through holes.
The follow guide lists vendors of electronics-grade, lead-free solder.
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